Author/Creator: Ang, G.B. - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Ang, G.B.

1. In-depth circuits edit analysis to reveal the implantation-related defect. (April 2017)

Authors:: Chen, C.Q.; Ang, G.B.; Lam, Jeffrey; Mai, Z.H.
Journal:: Microelectronics journal
Issue:: Volume 62(2017)
Page Start:: 38
Record Type:: Journal Article
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2. Electrical analysis on implantation-related defect by nanoprobing methodology. (September 2016)

Authors:: Chen, C.Q.; Ng, P.T.; Ang, G.B.; T an, H.; Rivai, Francis; Ma, Y.Z.; Ng, H.P.; Lam, Jeffery; Mai, Z.H.
Journal:: Microelectronics and reliability
Issue:: Volume 64(2016)
Page Start:: 317
Record Type:: Journal Article
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3. Electrical analysis on implantation-related defect by nanoprobing methodology. (September 2016)

Authors:: Chen, C.Q.; Ng, P.T.; Ang, G.B.; T an, H.; Rivai, Francis; Ma, Y.Z.; Ng, H.P.; Lam, Jeffery; Mai, Z.H.
Journal:: Microelectronics and reliability
Issue:: Volume 64(2016)
Page Start:: 317
Record Type:: Journal Article
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4. Static fault localization of subtle metallization defects using near infrared photon emission microscopy. (June 2017)

Authors:: Quah, A.C.T.; Nagalingam, D.; Moon, S.; Susanto, E.; Ang, G.B.; Neo, S.P.; Lam, J.C.; Mai, Z.H.
Journal:: Microelectronics and reliability
Issue:: Volume 73(2017)
Page Start:: 76
Record Type:: Journal Article
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5. Failure analysis methodology on donut pattern failure due to photovoltaic electrochemical effect. (September 2017)

Authors:: Neo, S.P.; Quah, A.C.T.; Ang, G.B.; Nagalingam, D.; Ma, H.H.; Ting, S.L.; Soo, C.W.; Chen, C.Q.; Mai, Z.H.; Lam, J.C.
Journal:: Microelectronics and reliability
Issue:: Volume 76/77(2017)
Page Start:: 255
Record Type:: Journal Article
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6. Embed SRAM IDDOFF fail root cause identification by combination of device analysis and localized circuit analysis. (September 2017)

Authors:: Chen, C.Q.; Ang, G.B.; Ng, P.T.; Rivai, Francis; Ng, H.P.; Quah, A.C.T.; Teo, Angela; Lam, Jeffery; Mai, Z.H.
Journal:: Microelectronics and reliability
Issue:: Volume 76/77(2017)
Page Start:: 261
Record Type:: Journal Article
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7. Application of Scanning Capacitance Microscopy on SOI device with wafer edge low yield pattern. (September 2017)

Authors:: Chen, C.Q.; Ang, G.B.; Ng, P.T.; Rivai, Francis; Neo, S.P.; Nagalingam, D.; Yip, K.H.; Lam, Jeffery; Mai, Z.H.
Journal:: Microelectronics and reliability
Issue:: Volume 76/77(2017)
Page Start:: 141
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗