Fabrication and characterization of germanium n-MOS and n-MOSFET with thermally oxidized yttrium gate insulator: Formation of underlying germanium oxide and its electrical characteristics. (1st August 2023)
- Record Type:
- Journal Article
- Title:
- Fabrication and characterization of germanium n-MOS and n-MOSFET with thermally oxidized yttrium gate insulator: Formation of underlying germanium oxide and its electrical characteristics. (1st August 2023)
- Main Title:
- Fabrication and characterization of germanium n-MOS and n-MOSFET with thermally oxidized yttrium gate insulator: Formation of underlying germanium oxide and its electrical characteristics
- Authors:
- Wen, Wei-Chen
Wang, Dong
Nakashima, Hiroshi
Yamamoto, Keisuke - Abstract:
- Abstract: A high-quality insulating film on germanium is essential for germanium applications. In this study, we oxidized metal yttrium at 500–550 °C to generate an yttrium oxide (Y-oxide) layer on germanium. According to transmission electron microscopy images, Y-oxide comprised three layers, which were Y2 O3, YGeO3, and GeOx from the top side. n-Type metal-oxide-semiconductor (n-MOS) capacitors and n-type MOS field-effect transistors (n-MOSFETs) with the Y-oxide gate insulator showed typical electrical characteristics. The n-MOS capacitor with the Y-oxide gate insulator had a lower interface state density ( D it ) and border trap density ( N bt ) than the n-MOS capacitor with a thermally oxidized GeOx insulator, suggesting that defects were terminated by Y atoms in the GeOx layer and GeOx /Ge interface. In contrast, the D it –energy distribution and N bt temperature dependence of the Y-oxide gate insulator were similar to those of the GeOx gate insulator, indicating that the defect signals originated in GeOx underlying YGeO3 . The structural analysis showed that the temperature of metal yttrium oxidation affected only the GeOx thickness. Therefore, adjusting the conditions of metal yttrium oxidation may produce Y-oxidized gate stacks with a thinner GeOx layer or even direct contact of YGeO3 and Ge, which may result in different D it values, N bt values, and N bt –temperature trends.
- Is Part Of:
- Materials science in semiconductor processing. Volume 162(2023)
- Journal:
- Materials science in semiconductor processing
- Issue:
- Volume 162(2023)
- Issue Display:
- Volume 162, Issue 2023 (2023)
- Year:
- 2023
- Volume:
- 162
- Issue:
- 2023
- Issue Sort Value:
- 2023-0162-2023-0000
- Page Start:
- Page End:
- Publication Date:
- 2023-08-01
- Subjects:
- Ge -- Gate stack -- Interface state -- Border trap
Semiconductors -- Periodicals
Integrated circuits -- Materials -- Periodicals
Semiconducteurs -- Périodiques
Circuits intégrés -- Matériaux -- Périodiques
Electronic journals
621.38152 - Journal URLs:
- http://www.sciencedirect.com/science/journal/latest/13698001 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.mssp.2023.107504 ↗
- Languages:
- English
- ISSNs:
- 1369-8001
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 5396.440600
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 27126.xml