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APA Citation

    Lee, S. Y., Kim, K. W., Kim, D. H., Yang, M. S., Kim, J. W., Choi, G., Lee, J. W., & Park, I. S. (2023). optimization study on the uniform temperature of an additively manufactured cooler for a semiconductor heating device. Applied thermal engineering, 225, . http://access.bl.uk/ark:/81055/vdc_100180910561.0x000025
  
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