Cite
HARVARD Citation
Su, W. et al. (2021). Wave Soldering Coupled Thermal-mechanical Simulation of Multi-layer Ceramic Capacitors. IOP conference series. 632 (4), p. . [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Su, W. et al. (2021). Wave Soldering Coupled Thermal-mechanical Simulation of Multi-layer Ceramic Capacitors. IOP conference series. 632 (4), p. . [Online].