Wave Soldering Coupled Thermal-mechanical Simulation of Multi-layer Ceramic Capacitors. Issue 4 (January 2021)

• Record Type: Journal Article
• Authors: Su, Wei; Luo, Wenhao; Li, Junkui; Liu, Renhuai
• Is Part Of: IOP conference series. Volume 632:Issue 4(2021)
• Publication Date: 2021-01
• Subjects: Wave Soldering -- Thermal-mechanical Coupling -- Thermal Stress -- Weak Parts; Earth sciences -- Periodicals; Environmental sciences -- Congresses; Environmental sciences -- Periodicals; 550.5
• DOI: 10.1088/1755-1315/632/4/042051
• Languages: English
• ISSNs: 1755-1307

Abstract

Abstract: In this paper, the thermal-mechanical coupling finite element analysis of MLCC wave soldering with heat conduction and heat convection is calculated, and the steady-state temperature field and transient temperature field as well as the stress distribution of MLCC are obtained. Using the finite element analysis method of indirect thermal-mechanical coupling, the stress analysis is carried out with the temperature field as the boundary condition, and the thermal-structural coupling model is established. By analyzing the thermal stress of MLCC, the weak parts sensitive to thermal stress are determined, which provides a useful reference for solving the reliability problem of MLCC wave soldering.