Atomic-scale surface of fused silica induced by chemical mechanical polishing with controlled size spherical ceria abrasives. (6th January 2023)
- Record Type:
- Journal Article
- Title:
- Atomic-scale surface of fused silica induced by chemical mechanical polishing with controlled size spherical ceria abrasives. (6th January 2023)
- Main Title:
- Atomic-scale surface of fused silica induced by chemical mechanical polishing with controlled size spherical ceria abrasives
- Authors:
- Xu, Guanghong
Zhang, Zhenyu
Meng, Fanning
Liu, Lu
Liu, Dongdong
Shi, Chunjing
Cui, Xiangxiang
Wang, Jianmei
Wen, Wei - Abstract:
- Abstract: Fused silica is widely used in precision optical devices for its excellent optical properties. However, it has hard and brittle nature, becoming a difficult-to-process material. This makes microscopic cracks left on the processed surface of silica induced by traditional mechanical processing methods. In this regard, it is a challenge to achieve an atomic-scale surface on silica. To overcome this challenge, nanometer CeO2 abrasives with uniform shape and size were prepared via a hydrothermal method. A novel chemical mechanical polishing (CMP) slurry is developed using the prepared CeO2 abrasives, Na2 CO3 and deionized water, which is low-cost, non-toxic, and environmentally friendly. The surface roughness, Sa of fused silica after CMP is 0.093 nm with a scanning area of 20 × 20 μm 2 . To the best of our knowledge, it is the lowest surface roughness on silica after CMP. The CMP mechanism was investigated by X-ray photoelectron spectroscopy and infrared Fourier transformation. Under alkaline conditions, the abrasives interacted with the silica forming a CeOSi reaction product, through a chemical tooth action, which is significant to produce an atomic-scale surface on silica. These findings provide a new pathway to fabricate atomic-scale surface for a hard-brittle solid.
- Is Part Of:
- Journal of manufacturing processes. Volume 85(2023)
- Journal:
- Journal of manufacturing processes
- Issue:
- Volume 85(2023)
- Issue Display:
- Volume 85, Issue 2023 (2023)
- Year:
- 2023
- Volume:
- 85
- Issue:
- 2023
- Issue Sort Value:
- 2023-0085-2023-0000
- Page Start:
- 783
- Page End:
- 792
- Publication Date:
- 2023-01-06
- Subjects:
- Fused silica -- Chemical mechanical polishing -- CeO2 -- Na2CO3 -- Deionized water
Production management -- Data processing -- Periodicals
Manufacturing processes -- Periodicals
Procestechnologie
Productietechniek
Production -- Gestion -- Informatique -- Périodiques
Fabrication -- Périodiques
Manufacturing processes
Production management -- Data processing
Periodicals
670.5 - Journal URLs:
- http://www.sciencedirect.com/science/journal/15266125 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.jmapro.2022.12.008 ↗
- Languages:
- English
- ISSNs:
- 1526-6125
- Deposit Type:
- Legaldeposit
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- British Library DSC - 5011.640000
British Library DSC - BLDSS-3PM
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