Effect of Sb content on the phase structure and interface structure of Sn1.0Ag0.5Cu lead-free solder. (January 2023)

• Record Type: Journal Article
• Authors: Xu, Fengxian; Zhu, Wenjia; Yan, Jikang; Zhao, Lingyan; Lv, Jinmei
• Is Part Of: Microelectronics and reliability. Volume 140(2023)
• Publication Date: 2023-01
• Subjects: Sn1.0Ag0.5Cu -- Sb powder -- Thermo-Calc -- Solder joint interface; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2022.114883
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: Based on the alloy Sn1.0Ag0.5Cu, Sb powder is added at a certain mass percentage to form the solder alloy Sn1.0Ag0.5CuxSb (x = 0 wt%, 0.5 wt%, 1.5 wt%). The melting point of the solder was determined by differential scanning calorimetry, the alloy interface morphology was observed by scanning electron microscopy, and energy-dispersive X-ray spectroscopy was performed to analyze phase compositions. Thermo-Calc software was used to calculate the variation in phase content, the solidification curve, Gibbs energy, the driving force, liquid/solid phase lines, the phase diagram, and the nucleation radius of Sn1.0Ag0.5CuxSb(wt%). In addition, the calculation results were used to explain the interface growth mechanism. According to the results, the precipitation/transition temperature of each phase and the content of the newly formed phase SnSb gradually increased with the increase in Sb content. After the addition of Sb, both temperatures of the liquid-phase line and the solid-phase line slightly increased, and the calculated values showed the same trend as the measured values. Two heat absorption peaks were observed during the melting process. The Gibbs energy and nucleation radius of the Cu6 Sn5 phase increased with the increase in Sb content, indicating that Sb can inhibit the growth of the Cu6 Sn5 phase. The addition of Sb rendered the Sn-rich phase denser and finer and reduced the thickness of the intermetallic compound layer and the generation of cracks; these changes intensified with increasing aging time. Comprehensive analysis revealed optimal reliability of the solder for an Sb content of 0.5 wt%. Highlights: With the increase of Sb content, the precipitation/transition temperature of each phase gradually increased, and the new phase SnSb phase gradually increased. The Gibbs energy and nucleation radius of Cu6 Sn5 phase increased with the increase of Sb content. Sb can obviously reduce the thickness of IMC layer and the crack generation.