In-field test solution for enhancing safety in automotive applications. (October 2022)

• Record Type: Journal Article
• Authors: Abotbol, Yehonatan; Dror, Shahar; Tshagharyan, Grigor; Harutyunyan, Gurgen; Zorian, Yervant
• Is Part Of: Microelectronics and reliability. Volume 137(2022)
• Publication Date: 2022-10
• Subjects: In-field test -- Automotive -- SoC -- Mission mode -- Built-in self-test; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2022.114774
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: Automotive market is evolving rapidly, while boosting and growing semiconductor industry significantly. According to the experts, we are only in the beginning of this exciting new chapter in the evolution – Autonomous Driving. Functional safety and quality requirements for Automotive are taking clearer shape while the industry is progressing for maturity. Therefore, System-on-Chip (SoC) and Intellectual Property (IP) providers must come up with a tailored and adaptive solution, to overcome various challenges. This process is enriching for all parties – SoC providers in incorporating various IPs that addresses different aspects, as well as providing the IP vendors with comprehensive guidelines to enhance their products to adhere these requirements. As a direct consequence to this process, Test and Repair IPs are influenced heavily. This paper presents a full-scale in-field test and repair solution concept for Automotive SoCs which conforms to all safety and quality requirements. Highlights: Built-in self-test Automotive In-field test Functional safety System-on-chip