A general approach for degradation modeling to enable a widespread use of aging simulations in IC design. (October 2022)

• Record Type: Journal Article
• Authors: Lange, André; Gonzalez, Fabio A. Velarde; Giering, Kay-Uwe; Vervantidis, Anastasios; Hahne, Lukas; Heinig, Andy; Jancke, Roland
• Is Part Of: Microelectronics and reliability. Volume 137(2022)
• Publication Date: 2022-10
• Subjects: Transistor reliability -- FET degradation -- Hot carrier injection -- Bias temperature instability -- Spice simulation -- Aging simulation -- Reliability test; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2022.114775
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: The importance of integrated circuit (IC) reliability has been growing to benefit from the potentials of advanced semiconductor technologies in long-living applications, such as automotive electronics. Today, prototypes and products are tested for their reliability. The most important procedures are summarized in the industry standard AEC-Q100 for automotive ICs. There are indications that these tests will not be sufficient for future applications so that simulation-based reliability assessments are expected to complement them soon. Circuit-level aging simulations are one approach to virtually investigate the IC reliability before entering manufacturing. Although they have been available for years, they still appear rarely used. Despite significant progress in research and industry, degradation modeling and validation of aging simulations are still demanding and need improvements. This article focuses on degradation modeling and outlines challenges as well as a solution approach to establish aging simulations as a widespread verification step in future IC design projects. Highlights: Discussion of aging simulations with inputs and challenges. Review of approaches for degradation modeling. Proposal of general approach for degradation modeling.