Reliability assessment of ball grid array joints under combined application of thermal and power cycling: solder geometry effect. Issue 1 (20th May 2020)

• Record Type: Journal Article
• Authors: Kumar, Sathish; Kuzichkin, Oleg R.; Siddiqi, Ahmed Faisal; Pustokhina, Inna; Krasnopevtsev, Aleksandr Yu
• Is Part Of: Soldering & surface mount technology. Volume 33:Issue 1(2021)
• Page Start: 27
• Page End: 33
• Publication Date: 2020-05-20
• Subjects: Solder joints -- Thermal fatigue -- Reliability -- Ball grid array (BGA); Brazing -- Periodicals; Solder and soldering -- Periodicals; 671.5605
• DOI: 10.1108/SSMT-02-2020-0006
• Languages: English
• ISSNs: 0954-0911

Abstract

Abstract : Purpose: This study aims to investigate simultaneous power and thermal loading. Design/methodology/approach: Finite element method simulations coupled with experiments. Findings: The effects of power cycling have been determined. Originality/value: This paper aims to testify the combined effects of thermal and power cycling loads on the reliability of solder ball joints with barrel- and hourglass-type geometries in an electronic system. The finite element simulation outcomes showed that the maximum strain energy was accumulated at the edges of barrel-type solder, whereas the hourglass-type was vulnerable at the necking side. It was also found that the hourglass-type solder showed a reliable behavior when the sole thermal cycling was exerted to the electronic system, whereas the barrel-type solder was a better choice under simultaneous application of thermal and power loadings. The experimental results also confirmed the finite element simulation and indicated that the solder joint reliability strongly depends on the geometry of interconnection in different operating conditions. An extensive discussion was presented to shed light on the paramount importance of combined thermal/power cycling on the reliability of solder joints.