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APA Citation
Lin, T., Liang, C., Wang, S., Lin, Y., Kao, C., Tarng, D., & Lin, K. (2021). inhibiting the detrimental Cu protrusion in Cu through-silicon-via by highly (111)-oriented nanotwinned Cu. Scripta materialia, , . http://access.bl.uk/ark:/81055/vdc_100123996501.0x000016