A built-in self-test and self-adjustment method of MEMS pressure sensor. (September 2022)

• Record Type: Journal Article
• Authors: Zhu, Manhong; Li, Jia; Wang, Weibing; Chen, Dapeng
• Is Part Of: Microelectronics and reliability. Volume 136(2022)
• Publication Date: 2022-09
• Subjects: MEMS -- Self-test -- Self-adjustment -- Reliability; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2022.114668
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: MEMS device degradation due to aging and other factors is becoming a major concern because it will cause parametric deviations and catastrophic failures in the mechanical and structural subsystems. However, MEMS testing in general which needs specific sophisticated testing equipment is complicated and time-consuming. To solve these problems, this paper specifically introduces a built-in self-test method which based on the periodic observation of the temperature-dependent output signal. A packaging scheme is designed and the test circuit is built to conduct test experiments on MEMS pressure sensors with different ranges and materials. The experimental results show that this method can effectively test the performance and will not affect the continued normal operation of the sensor. Furthermore, some compensation is made to correct the output to greatly improve the accuracy and reliability. Low cost, ease of implementation, and possibility to monitor in real time are the main advantages.