Cite
MLA Citation
Yue Wu et al.. “Interpenetration as a Mechanism for Negative Thermal Expansion in the Metal–Organic Framework Cu3(btb)2 (MOF‐14).” Angewandte Chemie international edition, vol. 53, no. 20, 2014, pp. 5175–5178. http://access.bl.uk/ark:/81055/vdc_100165611530.0x000022