Cite
HARVARD Citation
Wu, Y. et al. (2014). Interpenetration as a Mechanism for Negative Thermal Expansion in the Metal–Organic Framework Cu3(btb)2 (MOF‐14). Angewandte Chemie international edition. 53 (20), pp. 5175-5178. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Wu, Y. et al. (2014). Interpenetration as a Mechanism for Negative Thermal Expansion in the Metal–Organic Framework Cu3(btb)2 (MOF‐14). Angewandte Chemie international edition. 53 (20), pp. 5175-5178. [Online].