Cite
HARVARD Citation
Ferguson, M. et al. (2022). Mitigating Re-Entrant Etch Profile Undercut in Au Etch with an Aqua Regia Variant. Journal of the Electrochemical Society. 169 (8), p. . [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Ferguson, M. et al. (2022). Mitigating Re-Entrant Etch Profile Undercut in Au Etch with an Aqua Regia Variant. Journal of the Electrochemical Society. 169 (8), p. . [Online].