Cite
HARVARD Citation
Li, M. et al. (2022). Effect of grinding damage on cutting force and ductile machining during single grain scratching of monocrystalline silicon. Materials science in semiconductor processing. p. . [Online].
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Li, M. et al. (2022). Effect of grinding damage on cutting force and ductile machining during single grain scratching of monocrystalline silicon. Materials science in semiconductor processing. p. . [Online].