Infrared image correlation for thermal stress analysis of power devices. (September 2019)

• Record Type: Journal Article
• Authors: Watanabe, Akihiko; Masuda, Yoshiki; Omura, Ichiro
• Is Part Of: Microelectronics and reliability. Volume 100/101(2019)
• Publication Date: 2019-09
• Subjects: Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2019.113414
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: Thermal stress analysis is indispensable to improve the reliability of power devices. We propose a technique to observe a temperature distribution and a thermal strain simultaneously for thermal stress analysis of power devices. A temperature distribution is measured by an infrared (IR) camera and a thermal strain is measured by a digital image correlation (DIC) with IR images under a power cycling test. To apply DIC to IR images, we propose techniques to make a random pattern on the surface which can be recognized by IR camera even if a surface temperature is changed. This technique realises an observation with completely same field of view even in a localized area on power devices. This method provides an experimental means to verify simulation results of thermal stress analysis. Highlights: A thermal strain is measured by a digital image correlation with IR images under a power cycling test. This technique can obtain a temperature distribution and a thermal strain simultaneously. This technique was realized by making a random pattern on the surface which can be recognized by IR camera.