Cite
APA Citation
John Famoriji, O., Yan, X., Khan, M., Kashif, R., Fadamiro, A., Ali, M. S., & Lin, F. (2017). wireless Interconnect in Multilayer Chip-Area-Networks for Future Multimaterial High-Speed Systems Design. Wireless communications and mobile computing, 2017, . http://access.bl.uk/ark:/81055/vdc_100082240458.0x000042