Cite

MLA Citation

    R. Suda et al.. “Reductive Deposition of Thin Cu Films Using Ballistic Hot Electrons as a Printing Beam.” Journal of the Electrochemical Society, vol. 163, no. 6, 2016, pp. E162–E165. http://access.bl.uk/ark:/81055/vdc_100160132483.0x00005c
  
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