Investigations on deformation and fracture behaviors of the multi-alloyed SnAgCu solder and solder joint by in-situ observation. (August 2022)

• Record Type: Journal Article
• Authors: Zhu, Tangkui; Zhang, Qingke; Bai, Hailong; Zhao, Lingyan; Yan, Jikang
• Is Part Of: Microelectronics and reliability. Volume 135(2022)
• Publication Date: 2022-08
• Subjects: Multi-alloying -- Tensile strength -- Deformation behavior -- In-situ observation -- Elongation; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2022.114574
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: Recently multi-alloying has been used for optimization of the SnAgCu (SAC) solder. To comprehensively reveal the effects of multi-alloying on mechanical property of the SAC solder, in this study the Sb, Bi, Ni, In and Ce elements were added into the Sn-3.8Ag-0.7Cu (wt%) solder, then the deformation and fracture behaviors of the multi-alloyed SAC solder (MAS) and MAS/Cu solder joint were in-situ observed and compared with the SAC. The results reveal that more intermetallic compounds (IMCs) and some Bi particles are formed in the MAS, while the (Cu, Ni)6 Sn5 IMC in the MAS is refined. Due to the solid solution strengthening and precipitation strengthening, yield strength of the MAS increases by about 25 % compared with the SAC. Under tensile stress, severe slip and grain rotation occurs in the SAC solder, while plastic deformation of the MAS is restrained to a high extent by the dispersed particles within it. The MAS fractures in a tearing mechanism without obvious necking, but still shows a relative high elongation (~35 %), and the MAS has superior creep resistance since the dislocation motion and grain rotation are restrained. The deformation mismatch between the MAS and the Cu substrate is less serious, and the IMC at the MAS/Cu interface are less likely to fracture, resulting in a higher tensile strength (~160 MPa). Multi-alloying is recommended to improve the strength and creep resistance of the SAC. Highlights: The deformation behaviors of the multi-alloyed SAC solder (MAS) are investigated. In-situ observation was employed to show the dynamic deformation process. The grain rotation and strain localization are restrained in the MAS. The MAS fractures at a strain of 35 % without necking. The MAS shows much higher creep resistance than the SAC.