Cite
MLA Citation
Siyang Dai et al.. “The influence of subsurface damage depth on fracture strength of ground silicon wafers.” Materials today, vol. 64, 2022, pp. 1170–1174. http://access.bl.uk/ark:/81055/vdc_100159754143.0x000007
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Siyang Dai et al.. “The influence of subsurface damage depth on fracture strength of ground silicon wafers.” Materials today, vol. 64, 2022, pp. 1170–1174. http://access.bl.uk/ark:/81055/vdc_100159754143.0x000007