Cite
HARVARD Citation
Dai, S. et al. (2022). The influence of subsurface damage depth on fracture strength of ground silicon wafers. Materials today. pp. 1170-1174. [Online].
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Dai, S. et al. (2022). The influence of subsurface damage depth on fracture strength of ground silicon wafers. Materials today. pp. 1170-1174. [Online].