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APA Citation
Wu, Y., Shi, B., Liu, Y., Wang, L., Gao, J., Shen, Y., Wang, Y., Ma, Y., & Yu, S. (2022). design of Ta gradient layer to improve adhesion strength between Cu substrate and DLC film. Vacuum, 203, . http://access.bl.uk/ark:/81055/vdc_100159753162.0x000053