An experimental study of carbonyl powder power inductor cracking during reflow process. Issue 2 (13th July 2020)

• Record Type: Journal Article
• Authors: Rehman, Faisal; Asghar, Rafiq; Iqbal, Kashif; Aman, Ali; Nawaz, Agha Ali
• Is Part Of: Soldering & surface mount technology. Volume 33:Issue 2(2021)
• Page Start: 86
• Page End: 93
• Publication Date: 2020-07-13
• Subjects: Crack -- Thermal shock -- Carbonyl powder ceramic inductor -- Power inductor -- Reflow oven -- Reflow profile; Brazing -- Periodicals; Solder and soldering -- Periodicals; 671.5605
• DOI: 10.1108/SSMT-10-2019-0033
• Languages: English
• ISSNs: 0954-0911

Abstract

Abstract : Purpose: In surface mount assembly (SMA) process, small components are subjected to high temperature variations, which result in components' deformation and cracking. Because of this phenomenon, cracks are formed in the body of carbonyl powder ceramic inductor (CPCI) in the preheat and cooling stages of the reflow oven. These cracks become the main cause of board failure in the ageing process. The purpose of this paper is to ascertain the thermal stress, thermal expansion of carbonyl iron ceramics and its effects on crack commencement and proliferation in the preheat stage of reflow oven. Moreover, this paper also categorized and suggested important parameters of reflow profile that could be used to eliminate these thermal shock failures. Design/methodology/approach: In this paper, two different reflow profiles were studied that evaluate the thermal shock of CPCI during varying ΔT at the preheat zone of the reflow oven. In the first profile, the change in temperature ΔT at preheat zone was set to 3.26°C/s, which has resulted in a number of device failures because of migration of micro cracks through the CPCI. In the second profile, this ΔT at preheat stage is minimized to 2.06°C/s that eliminated the thermal stresses; hence, the failure rates were significantly reduced. Findings: TMPC0618H series lead (Pb)-free CPCI is selected for this study and its thermal expansion and thermal shock are observed in the reflow process. It is inferred from the results that high ΔT at preheat zone generates cracks in the carbonyl powder-type ceramics that cause device failure in the board ageing process. Comparing materials, carbonyl powder ceramic components are less resistant to thermal shock and a lower rate of temperature change is desirable. Originality/value: The proposed study presents an experimental analysis for mitigating the thermal shock defects. The realization of the proposed approach is validated with experimental data from the printed circuit boards manufacturing process.