Low RH and temperature effect on 0201 sized passive components during SMT mounting. Issue 1 (6th September 2019)

• Record Type: Journal Article
• Authors: Asghar, Rafiq; Rehman, Faisal; Aman, Ali; Iqbal, Kashif
• Is Part Of: Soldering & surface mount technology. Volume 32:Issue 1(2020)
• Page Start: 48
• Page End: 54
• Publication Date: 2019-09-06
• Subjects: Printed circuit board (PCB) -- 0201 passive SMDs -- Electrostatic discharge (ESD) -- Low relative humidity -- Pick and place machine -- Surface mount technology (SMT); Brazing -- Periodicals; Solder and soldering -- Periodicals; 671.5605
• DOI: 10.1108/SSMT-02-2019-0006
• Languages: English
• ISSNs: 0954-0911

Abstract

Abstract : Purpose: Low relative humidity (RH) effect surface mount devices in numerous ways. The smaller size (0201) capacitor and resistor start wasting when RH is low. Due to low RH, electrostatic charges built-up on the surface of surface mount devices (SMDs) and component's reel. The positive charged SMDs stick with the negatively charged reel tape and are wasted. This paper comprehensively explores the environmental effects on 0201 size surface mount devices during mounting process. Different type and size of surface mount devices are tested in low and desired RH to validate the effectiveness of the proposed approach. This paper will also highlight high electrostatic discharge (ESD) due to low RH which can be detrimental for small size surface mount devices. The experimental and graphical illustrations will stipulate the results of success rate for mounting components. The effect on ESD, subsequently varying temperature and humidity will also be analyzed. Design/methodology/approach: In this paper, 0201 SDMs will be considered for analysis. The surface mount technology (SMT) plant temperature and humidity has been varied to examine the properties of small size SMDs. Total 5 hours production data are collected from Laptop motherboard production environment. This approach is applicable to all SMT environment. Findings: The authors reduced the wastage of 0201 chip size resistor and capacitor. Total 11 components are selected of this size, and there success rate is observed during mounting. These components are first observed in harsh environment where the temperature is first set to 20ºC and RH is set to 25 per cent. The success rate of these components is very low due to component's wastage. When the plant temperature is set to 25ºC and RH is set to 45 per cent, the success rate of mounting increased up to 100 per cent. A single component placement success rate with respect to RH is observed for one month. The results are shown in Table IV. It can be seen that the success rate is near 100 per cent when RH and temperature is maintained in production environment. To eliminate the ESD build-up in material and equipment in manufacturing environment humidification is a very effective way. When the RH is kept to 45 per cent, the moisture content of the air is a natural conductor and earths any ESD in environment. Originality/value: Experimental data have been obtained from Laptop motherboard manufacturing process to validate the effectiveness of proposed approach.