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APA Citation
Ahmed, O., Okoro, C., Pollard, S., & Jiang, T. (2021). the effect of materials and design on the reliability of through-glass vias for 2.5 D integrated circuits: a numerical study. Multidiscipline modeling in materials and structures, 17(2), 451–464. http://access.bl.uk/ark:/81055/vdc_100155982346.0x000022