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APA Citation
Tian, Y., Fang, H., Ren, N., Qiu, C., Chen, F., & Sitaraman, S. (2020). intermetallics evolution and its reliability effects on micro-joints in flip chip assemblies. Microelectronics international, 37(3), 117–124. http://access.bl.uk/ark:/81055/vdc_100157800363.0x000032