Cite
HARVARD Citation
Tian, Y. et al. (2020). Intermetallics evolution and its reliability effects on micro-joints in flip chip assemblies. Microelectronics international. 37 (3), pp. 117-124. [Online].
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Tian, Y. et al. (2020). Intermetallics evolution and its reliability effects on micro-joints in flip chip assemblies. Microelectronics international. 37 (3), pp. 117-124. [Online].