Electrodeposition assisted sol-gel process to prepare CZTS thin films. (September 2022)
- Record Type:
- Journal Article
- Title:
- Electrodeposition assisted sol-gel process to prepare CZTS thin films. (September 2022)
- Main Title:
- Electrodeposition assisted sol-gel process to prepare CZTS thin films
- Authors:
- Xiang, Dongmei
Zhao, Aimei
Li, Bing
Peng, Zhuo
Yuan, Yujie
Xing, Yupeng
Yao, Liyong
Bi, Jinlian
Li, Wei
Zhang, Xiaoyong - Abstract:
- Abstract: The traditional sol-gel process usually takes a long time to form a stable Cu2 ZnSnS4 (CZTS) sol-gel solution, which increases the whole process time. In this paper, an electrodeposition assisted sol-gel process was employed to reduce the solution preparation time. Cu was electrodeposited on Mo surface and ZnSnS sol-gel was rotated on Cu surface to prepare CZTS films. The solution preparation time was reduced from 12h to 30min. The mechanism of CZTS phase formation with sol-gel method assisted by electrodeposition was studied. Cu3 SnS4 phase was formed during the electrodeposition assisted sol-gel process, while Cu2 SnS3 phase was formed when the CZTS precursor during sol-gel process. Cu content was rich at the beginning of the reaction to form Cu3 SnS4 during the electrodeposited assisted sol-gel process. CZTS films with Cu/(Zn + Sn) of 0.84 and Zn/Sn of 1.03 were prepared by sol-gel method assisted by electrodeposition. Compared with CZTS films prepared by sol-gel method, CZTS films prepared by this method have larger and more uniform grains. It is also found that the thickness of MoS2 layer was thinner than the one prepared by sol-gel method. Highlights: An electrodeposition assisted sol-gel method was employed to prepare CZTS films. The solution preparation time was reduced from overnight to 30min. The grains of CZTS films prepared by this method were larger and more uniform than the one prepared by sol-gel method. Electrodeposited Cu helped to suppress theAbstract: The traditional sol-gel process usually takes a long time to form a stable Cu2 ZnSnS4 (CZTS) sol-gel solution, which increases the whole process time. In this paper, an electrodeposition assisted sol-gel process was employed to reduce the solution preparation time. Cu was electrodeposited on Mo surface and ZnSnS sol-gel was rotated on Cu surface to prepare CZTS films. The solution preparation time was reduced from 12h to 30min. The mechanism of CZTS phase formation with sol-gel method assisted by electrodeposition was studied. Cu3 SnS4 phase was formed during the electrodeposition assisted sol-gel process, while Cu2 SnS3 phase was formed when the CZTS precursor during sol-gel process. Cu content was rich at the beginning of the reaction to form Cu3 SnS4 during the electrodeposited assisted sol-gel process. CZTS films with Cu/(Zn + Sn) of 0.84 and Zn/Sn of 1.03 were prepared by sol-gel method assisted by electrodeposition. Compared with CZTS films prepared by sol-gel method, CZTS films prepared by this method have larger and more uniform grains. It is also found that the thickness of MoS2 layer was thinner than the one prepared by sol-gel method. Highlights: An electrodeposition assisted sol-gel method was employed to prepare CZTS films. The solution preparation time was reduced from overnight to 30min. The grains of CZTS films prepared by this method were larger and more uniform than the one prepared by sol-gel method. Electrodeposited Cu helped to suppress the formation of MoS2 . … (more)
- Is Part Of:
- Materials science in semiconductor processing. Volume 148(2022)
- Journal:
- Materials science in semiconductor processing
- Issue:
- Volume 148(2022)
- Issue Display:
- Volume 148, Issue 2022 (2022)
- Year:
- 2022
- Volume:
- 148
- Issue:
- 2022
- Issue Sort Value:
- 2022-0148-2022-0000
- Page Start:
- Page End:
- Publication Date:
- 2022-09
- Subjects:
- Electrodeposition -- Sol-gel -- CZTS thin Films -- MoS2 thickness
Semiconductors -- Periodicals
Integrated circuits -- Materials -- Periodicals
Semiconducteurs -- Périodiques
Circuits intégrés -- Matériaux -- Périodiques
Electronic journals
621.38152 - Journal URLs:
- http://www.sciencedirect.com/science/journal/latest/13698001 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.mssp.2022.106784 ↗
- Languages:
- English
- ISSNs:
- 1369-8001
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 5396.440600
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 21839.xml