Cite
HARVARD Citation
Guo, C. et al. (2022). A thermally conductive interface material with tremendous and reversible surface adhesion promises durable cross-interface heat conduction. Materials horizons. 9 (6), pp. 1690-1699. [Online].
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Guo, C. et al. (2022). A thermally conductive interface material with tremendous and reversible surface adhesion promises durable cross-interface heat conduction. Materials horizons. 9 (6), pp. 1690-1699. [Online].