A thermally conductive interface material with tremendous and reversible surface adhesion promises durable cross-interface heat conduction. Issue 6 (8th April 2022)

• Record Type: Journal Article
• Authors: Guo, Cong; Li, Yuhan; Xu, JianHua; Zhang, Qin; Wu, Kai; Fu, Qiang
• Is Part Of: Materials horizons. Volume 9:Issue 6(2022)
• Page Start: 1690
• Page End: 1699
• Publication Date: 2022-04-08
• Subjects: Materials -- Research -- Periodicals; 543.0284
• DOI: 10.1039/d2mh00276k
• Languages: English
• ISSNs: 2051-6347

Abstract

Abstract : A ternary polyurethane composite with high isotropic thermal conductivity, electrical insulation and temperature-responsive reversible adhesion was synthesized, promising low thermal resistance and durable thermal contact with electronic substrates. Abstract : The dramatic miniaturization and integration of electronic devices call for next-generation thermally conductive interface materials with higher service performance and long-term stability. In addition to enhancing the inherent thermal conductivity of materials, it is noteworthy to pay attention to the thermal contact resistance. Herein, we synthesized a polyurethane with hierarchical hydrogen bonding to realize high surface adhesion with substrates; another key was incorporating aluminum oxide modified by a deformable liquid metal to improve the thermo-conductive capability and offer the freedom of polymeric segmental motions. These molecular and structural designs endow the composite with high isotropic thermal conductivity, electrical insulation and temperature-responsive reversible adhesion, which enable low thermal resistance and durable thermal contact with substrates without the need for external pressure.