Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics. (June 2022)

• Record Type: Journal Article
• Authors: Gschwandl, Mario; Friedrich, Birgit; Pfost, Martin; Antretter, Thomas; Fuchs, Peter Filipp; Mitev, Ivaylo; Tao, Qi; Schingale, Angelika
• Is Part Of: Microelectronics and reliability. Volume 133(2022)
• Publication Date: 2022-06
• Subjects: Reliability -- Power electronics -- Printed circuit boards -- Finite element analysis; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2022.114537
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: Power electronics are key-enablers of several industry trends, such as more efficient renewable energy harvesting, eco-friendly mobility and many more. With their uprising use and versatility the requirement for these packages is steadily increasing; thus leading to an evermore complex electro-thermo-mechanical loading situation. On the one side, external loads such as vibrations or weather extremes leading to challenging thermal loading situations are present. On the other side, internal loads generated by the active semiconductor within a power package result in high temperature loads as well as high temperature gradients; promoting several failure modes caused by arising thermo-mechanical stresses. Consequently, the proper design of the thermal management of these devices plays a key role in their reliability. To this end, a multi-physics multi-domain approach is proposed to improve the operational reliability of power packages, by precisely describing the actual loading situation and assessing the lifetime of the entire system. Thereby, in a global modeling approach entire PCB assemblies (PCB-A) with actively loaded power packages can be examined electro-thermo-mechanically. Based upon the results of the global model areas of interest are identified, e.g. an area with high stress concentrations, and investigated further using sub-modeling approaches and local damage modeling. To verify the developed methodologies an electro-thermal experimental test is used - a so-called Power Thermal Cycle (PTC) test. Using the proposed simulation strategy, critical areas can be determined and virtually investigated; enabling the evaluation of arbitrary power electronic systems, without the need of performing a time-consuming PTC test. Highlights: For precise electro-thermo-mechanical FE-prediction of microelectronic systems, a detailed PCB model is necessary. Detailed PCB modeling enables determination of a mutual influence of neighboring power packages. A major part of arising stresses at package level is introduced by the active electrical loading.