Toward a multi-physical approach to connection ageing in power modules. (May 2022)

• Record Type: Journal Article
• Authors: Pellecuer, G.; Forest, F.; Huselstein, J.-J.; Martiré, T.; Arnould, O.; Chrysochoos, A.
• Is Part Of: Microelectronics and reliability. Volume 132(2022)
• Publication Date: 2022-05
• Subjects: Reliability -- IGBT power modules -- Power cycling -- Thermomechanical fatigue -- Wire bonds; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2022.114513
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: Generally, studies on ageing of power module have very often sought to write phenomenological laws able to give an estimate of their lifespan. These laws, identified experimentally, are empirical functions of the characteristic electrical loads that the component must withstand. As an alternative, this paper presents a first attempt of numerical approach for wire bond ageing in semiconductor power modules that takes account for the different multi-physical coupling mechanisms that occur during the component life. The electro-thermal and thermo-mechanical interactions are physically described and numerically modeled. The calculations show important viscoplastic strains in the connection zones and bonding wires from the first loading cycles. A quasi-cyclic stabilization of the mechanical and thermal states is observed at more than a hundred cycles (viscoplastic shakedown). The creep-fatigue damage mechanisms become then preponderant inducing mechanical-electrical couplings. Highlights: Multi physical coupling mechanism. Finite element method for studying the wirebond ageing. Electrothermal and thermomechanical effects. Viscolplastic behaviour identification. Cyclic viscoplastic shakedown.