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APA Citation
Yuan, S., Guo, X., Liu, S., Li, P., Liu, F., Zhang, L., & Kang, R. (2022). atomistic understanding of the subsurface damage mechanism of silicon (100) during the secondary nano-scratching processing. Materials science in semiconductor processing, 144, . http://access.bl.uk/ark:/81055/vdc_100153011976.0x000026