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Yuan, S. et al. (2022). Atomistic understanding of the subsurface damage mechanism of silicon (100) during the secondary nano-scratching processing. Materials science in semiconductor processing. p. . [Online].
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Yuan, S. et al. (2022). Atomistic understanding of the subsurface damage mechanism of silicon (100) during the secondary nano-scratching processing. Materials science in semiconductor processing. p. . [Online].