(Keynote) Low Temperature SmartCutTM Process for 3D Integration. (24th April 2020)

• Record Type: Journal Article
• Authors: Schwarzenbach, Walter; Reboh, Shay; Ghorbel, Aymen; Gaudin, Gweltaz; Besnard, Guillaume; Mazen, Frédéric; Loup, Virginie; Maitrejean, Sylvain; Brunet, Laurent; Nguyen, Bich-Yen; Maleville, Christophe
• Is Part Of: ECS transactions. Volume 97:Number 5(2020)
• Page Start: 129
• Page End: 133
• Publication Date: 2020-04-24
• Subjects: Electrochemistry -- Periodicals; Electrochemistry; Periodicals; Electronic journals; Electronic journal; 541.37
• DOI: 10.1149/09705.0129ecst
• Languages: English
• ISSNs: 1938-5862

Abstract

Abstract : To support 3D Sequential integration with a cost-effective layer transfer, SmartCut™ process at low temperature (below 500 °C) is proposed. Excellent SOI & BOX layer thickness uniformities are demonstrated, while layer integrity, electron and hole mobility performances are already compliant with development grade requirements.