(Keynote) Low Temperature SmartCutTM Process for 3D Integration. (24th April 2020) - Schwarzenbach, Walter
Abstract : To support 3D Sequential integration with a cost-effective layer transfer, SmartCut™ process at low temperature (below 500 °C) is proposed. Excellent SOI & BOX layer thickness uniformities are demonstrated, while layer integrity, electron and hole mobility performances are already compliant with development grade requirements.