Cite
MLA Citation
Hiroyuki Miyazaki et al.. “Improved resistance to thermal fatigue of active metal brazing substrates for silicon carbide power modules using tough silicon nitrides with high thermal conductivity.” Ceramics international, vol. 44, no. 8, 2018, pp. 8870–8876. http://access.bl.uk/ark:/81055/vdc_100066215737.0x000033