Cite
MLA Citation
Jungsoo Kim et al.. “Effective (Pd, Ni)Sn4 diffusion barrier to suppress brittle fracture at Sn-58Bi-xAg solder joint with Ni(P)/Pd(P)/Au metallization pad.” Microelectronics and reliability, vol. 129, 2022, p. . http://access.bl.uk/ark:/81055/vdc_100150529531.0x00005a