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APA Citation
Park, S., Cho, W., Jeong, B., Jung, J., Sung, S., Na, H., Kim, S., Lee, M., & Han, H. N. (2022). a dual-scale FE simulation of hole expansion test considering pre-damage from punching process. International journal of solids and structures, 236, . http://access.bl.uk/ark:/81055/vdc_100150527874.0x00005b