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APA Citation
Tsurumi, N., Tsuji, Y., Baba, T., Murata, H., Masago, N., & Yoshizawa, K. (2022). comparative study of the ideal and actual adhesion interfaces of the die bonding structure using conductive adhesives. Journal of adhesion, 98(1), 24–48. http://access.bl.uk/ark:/81055/vdc_100148639823.0x000057