Cite
HARVARD Citation
Tsurumi, N. et al. (2022). Comparative study of the ideal and actual adhesion interfaces of the die bonding structure using conductive adhesives. Journal of adhesion. 98 (1), pp. 24-48. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Tsurumi, N. et al. (2022). Comparative study of the ideal and actual adhesion interfaces of the die bonding structure using conductive adhesives. Journal of adhesion. 98 (1), pp. 24-48. [Online].