Cite
APA Citation
Yang, L., Wang, D., Liu, M., Liu, H., Tan, J., Wang, Z., Zhou, H., Yu, Q., Wang, J., Lin, J., Zou, X., Qiu, L., Cheng, H., & Liu, B. (2021). glue-assisted grinding exfoliation of large-size 2D materials for insulating thermal conduction and large-current-density hydrogen evolution. Materials today, 51, 145–154. http://access.bl.uk/ark:/81055/vdc_100148049325.0x000037