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APA Citation
Ben Romdhane, E., Roumanille, P., Guédon-Gracia, A., Pin, S., Nguyen, P., & Frémont, H. (2021). from early microstructural evolution to intergranular crack propagation in SAC solders under thermomechanical fatigue. Microelectronics and reliability, 126, . http://access.bl.uk/ark:/81055/vdc_100146764309.0x00004d