On-line temperature measurement during power cycle of PCB-embedded diode. (November 2021)

• Record Type: Journal Article
• Authors: Bensebaa, S.; Berkani, M.; Petit, M.; Lefebvre, S.
• Is Part Of: Microelectronics and reliability. Volume 126(2021)
• Publication Date: 2021-11
• Subjects: Power cycling -- Chip temperature measurement -- Junction temperature measurement -- Thermo sensitive electrical parameter (TSEP) -- Schottky diode -- Thermal voltage -- Cycling test circuit; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2021.114313
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: This paper presents an original methodology and a test bench for active power cycling and on-line junction temperature measurement during power cycling of power devices embedded in PCB. This method is based on the use of the ratio between forward voltage and forward current variations (∆ V F, ∆ I F ) during conduction period to estimate the thermal voltage U T and thus the junction temperature in real time. The objective of this study is to estimate the junction temperature even for high frequency of power cycling tests. First, the measurement method is presented, and then the test bench is described. Highlights: Original methodology and a test bench for active power cycling. On-line junction temperature measurement. Using the forward voltage V F and forward current I F evolutions during conduction to estimate diode junction temperature. Simulating junction temperature evolution during power cycling (ANSYS Twin Builder©). Circuit design.