Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions. Issue 12 (December 2015)

• Record Type: Journal Article
• Authors: Yan, Haidong; Mei, Yunhui; Li, Xin; Zhang, Pu; Lu, Guo-Quan
• Is Part Of: Microelectronics and reliability. Volume 55:Issue 12 Part A(2015)
• Page Start: 2532
• Page End: 2541
• Publication Date: 2015-12
• Subjects: Nanosilver paste -- Laser module -- Die-attach interface -- Pulse mode -- Reliability; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2015.07.037
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: This paper is mainly reported to a pulse reliability investigation of high power single emitter laser modules with nanosilver paste. Comparative experiments in continuous pulse conditions for the laser modules packaged with nanosilver paste, indium and AuSn solders were conducted. The results indicate that the laser modules attached by nanosilver paste have a longer-term lifetime than those with indium and AuSn solders in continuous pulse conditions. Transient thermal behavior and coupled thermo-mechanical behavior in continuous pulse conditions are simulated by finite element method (FEM). A semi-empirical model based on Arrhenius relationship is established to provide relative reliability assessments for laser modules by combining with the simulating results. Highlights: The laser modules using nano-Ag show longer lifetime than those using In and AuSn solders. There is no evident defect such as voids/cracks could be observed in the sintered silver joint after pulse aging. The degradation of laser modules under the CP mode should be due to the failure of the laser diodes, not die attachment.