Cite
MLA Citation
H.H. Yap et al.. “Top-down delayering to expose large inspection area on die side-edge with Platinum (Pt) deposition technique.” Microelectronics and reliability, vol. 55, no. 9, 2015, pp. 1611–1616. http://access.bl.uk/ark:/81055/vdc_100051209439.0x000058