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APA Citation
Lee, E., Kang, J., Kang, M., Kim, K., Park, S., Kim, Y. S., Kim, I., Kim, S., & Bae, J. (2021). high thermal conductivity of boron nitride filled epoxy composites prepared by tin solder nanoparticle decoration. Composites, , . http://access.bl.uk/ark:/81055/vdc_100142336764.0x000023