Cite
HARVARD Citation
Lee, E. et al. (2021). High thermal conductivity of boron nitride filled epoxy composites prepared by tin solder nanoparticle decoration. Composites. p. . [Online].
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Lee, E. et al. (2021). High thermal conductivity of boron nitride filled epoxy composites prepared by tin solder nanoparticle decoration. Composites. p. . [Online].