Cite
MLA Citation
Mingxing Du et al.. “Bond wire lift-off monitoring based on intersection point movement characteristic in IGBT module.” Microelectronics journal, vol. 116, 2021, p. . http://access.bl.uk/ark:/81055/vdc_100142313333.0x00005d
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Mingxing Du et al.. “Bond wire lift-off monitoring based on intersection point movement characteristic in IGBT module.” Microelectronics journal, vol. 116, 2021, p. . http://access.bl.uk/ark:/81055/vdc_100142313333.0x00005d